精品综合久久久久久97_亚洲国产精品久久久久婷婷老年_成人区人妻精品一区二区三区_国产精品JIZZ在线观看老狼_国产欧美精品一区二区三区

WS2 Micropowder

平均粒徑范圍：0.4-1微米

純度> 99%

Properties:

• Average Particle Size: 0.4-1 microns

• Purity: 99%

  WS2 Micropowder is useful for creating WS2 solutions with applications ranging from electronics to energy storage. The powder may be sonicated in a range of liquid solvents, whereas the longer sonication takes place, the smaller the flake size in solution. Further, before sonication the solution will be silvery, and after it will turn a greenish-yellow. The solvents useful during sonication include benzyl benzoate, isopropanol, acetone, methanol, and many others.

  The liquid dispersion may then be used to create a thin film on the substrate of your choosing. These thin-films have a range of applications, such as transistors, solar cells, and energy storage devices.

  WS2 solution can also be used in composite materials.

  The difference between our micropowders and ultrafine powders are their flake sizes. Ultrafine powders have smaller flakes, and create dispersions with smaller particle sizes after sonication than micropowder. Micropowders require more sonication and will result in flakes with larger lateral dimensions. Micropowder is a low-cost alternative to our ultrafine powder.

  WS₂ Micropowder SEM image

  
  

   

  Applications:

• Transparent and Flexible Electronics

• Transistors

• Composite Materials

• Chemical and bio-sensors

• Semiconductor printable inks

  Academic References:

  Electrical Characteristics of Molybdenum Disulfide Flakes Produced by Liquid Exfoliation, Lee et al. Adv. Mater. 2011, 23, pp. 4178-4182

  Gelatin-assisted fabrication of water-dispersible graphene and its inorganic analogues, Ge et al. J. Mater. Chem. 2012, 22, pp. 17619-17624

  Preparation of High Concentration Dispersions of Exfoliated MoS2 with Increased Flake Size, O.Neill et al. Chem. Mater. 2012, 24, pp. 2414-2421

  Two-Dimensional Nanosheets Produced by Liquid Exfoliation of Layered Materials, Coleman et al. Science, 2011, 331, pp. 568-571