**可切斷的工件尺寸：156×156×700mm
切割速度：1800m/min
機器重量：12500kg
本機器主要用于硅片、玻璃等各種硬、脆性材料切割分解成片狀，可達到提高切割精度，提高工作效率，節(jié)省原材料，減少下道工序工作量的目的。
The machine is mainly used for cutting and decomposing all kinds of hard and brittle materials such as silicon wafer and glass into sheets, which can improve cutting accuracy, improve work efficiency.