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LOAD LOCK Chamber (option)

LOAD LOCK預(yù)真空進樣室（可選）

Chamber with front open door

前開門蒸發(fā)腔體

Cryopump and dry pump

冷凝泵和干泵

Multiple thermal evaporation sources or OLED sources

多個熱阻蒸發(fā)源或OLED低溫蒸發(fā)源

Max. 6” substrate

6”基片

Substrate rotation

基片旋轉(zhuǎn)

Substrate bias (option)

基片偏壓（可選）

Ion source for substrate cleaning (option)

離子源清洗基片（可選）

Substrate heating to 1000C (option)

基片加熱1000度(可選)

Crystal rate monitor and film thickness control

晶振沉積速率及膜厚控制

Manual or automatic system control

系統(tǒng)手動或自動控制

For deposition of metal， semiconductor and insulation materials

可沉積金屬、半導(dǎo)體和絕緣材料

For deposition of multi-layer or alloy film